Been around with bags, a disease at this point.
Been using the Bellroy Transit Workpack (20L) for a while now. It works because:

• It's lightweight.
• Zippers are smooth, materials are soft, and compartments are buttery to interact with, yet durable.
• Practical, fits all my needs and gives me more space than I need.

It doesn't work because:

• There's no strap for luggage handles on the back, making travel a bit inconvenient.
• Has a little too much space for my needs. I would love a 16-18L version with slightly smaller dimensions.

Thought I'd try out the Aer Pro Pack 20L, but was disappointed. While it's spacious, functional for most people and a lot of my needs, and padding is fantastic:

• I forgot how rigid and stiff their bags are. While this "durability" is needed for some, I'm just going in and out of meetings in the city and some travel here and there. I need to practically wrestle with the bag to get anything in and out (slight exaggeration) due to its stiffness.
• Zippers are no where close to how buttery smooth zippers are on the Bellroy bag.
• It's bulkier than I imagined, bulkier than the Bellroy, I wanted something smaller, not bigger or bulkier.
• Has way more compartments than I need.
• Not to anyone's fault, but as it was an international order, it's a final sale.

Thinking of getting the Aer City Pack, but worried again as its a final sale and it doesn't seem smaller or less bulkier than the Pro Pack. I would safely presume the same rigidity and stiffness.
Here's what I'm not looking for:

• Tom Bihn: Butt-ugly (no offense).
• WANDRD: Too photography focused.
• Peak Design: Too photography focused, not a fan of the side panels for my needs, not sure it's smaller.
• Black Ember: Seem cool, seem bulkiebigger. Can reconsider.
• Bellroy: Via Backpack (don't like the light beige interior), Classic Backpack Compact (no luggage strap at the back).
• Topo Design: Nothing that I liked.
• TUMI: Don't want to go back, cool, but overly priced.

I carry: MacBook Air 14", small pouch with gym shorts, power bank (for laptop + phone), two cables, two small adapter cables, two tiny bottles (bug spray, hand sanitizer), small pills container, 1L water bottle, sunglasses hardcase, small wallet, AirPods, small MagSafe battery pack.
Any guidance?

Been around with bags, a disease at this point.
Been using the Bellroy Transit Workpack (20L) for a while now. It works because:

• It's lightweight.
• Zippers are smooth, materials are soft, and compartments are buttery to interact with, yet durable.
• Practical, fits all my needs and gives me more space than I need.

It doesn't work because:

• There's no strap for luggage handles on the back, making travel a bit inconvenient.
• Has a little too much space for my needs. I would love a 16-18L version with slightly smaller dimensions.

Thought I'd try out the Aer Pro Pack 20L, but was disappointed. While it's spacious, functional for most people and a lot of my needs, and padding is fantastic:

• I forgot how rigid and stiff their bags are. While this "durability" is needed for some, I'm just going in and out of meetings in the city and some travel here and there. I need to practically wrestle with the bag to get anything in and out (slight exaggeration) due to its stiffness.
• Zippers are no where close to how buttery smooth zippers are on the Bellroy bag.
• It's bulkier than I imagined, bulkier than the Bellroy, I wanted something smaller, not bigger or bulkier.
• Has way more compartments than I need.
• Not to anyone's fault, but as it was an international order, it's a final sale.

Thinking of getting the Aer City Pack, but worried again as its a final sale and it doesn't seem smaller or less bulkier than the Pro Pack. I would safely presume the same rigidity and stiffness.
Here's what I'm not looking for:

• Tom Bihn: Butt-ugly (no offense).
• WANDRD: Too photography focused.
• Peak Design: Too photography focused, not a fan of the side panels for my needs, not sure it's smaller.
• Black Ember: Seem cool, seem bulkiebigger. Can reconsider.
• Bellroy: Via Backpack (don't like the light beige interior), Classic Backpack Compact (no luggage strap at the back).
• Topo Design: Nothing that I liked.
• TUMI: Don't want to go back, cool, but overly priced.

I carry: MacBook Air 14", small pouch with gym shorts, power bank (for laptop + phone), two cables, two small adapter cables, two tiny bottles (bug spray, hand sanitizer), small pills container, 1L water bottle, sunglasses hardcase, small wallet, AirPods, small MagSafe battery pack.
Any guidance?

need some advice for my first build: what y’all think is better for an o3? AOS 5 or TBS source one v5 with some mods to fit the camera? i’ve been trying to research how hard it is to make the o3 fit in the source one and apparently it just drops right into the AOS. it would be a no brainer if the AOS wasn’t over double the price lol. also any advice on my build would be good too: speedybee f405 v3, xing e pro 2306 2450kv motors and o3 air unit. plan to run it on 4s with goggles v2 and the dji controller. anything more i would need besides the parts listed? side note: i’ve been told the geprc mark 5 is much better and i think i will be going with that one

I have an OPPO X5 Pro and just bought myself an dji fpv (very happy), its my 4th dji drone (phantom 3 S, mavic pro, inspire 1v2.0). I want to learn how to fpv, wo downloaded simulator apk from dji website. However, I cant connect goggles with my phone. I connect short cable to goggles, then long otg cable from that, to my phone, I enable OTG on my phone. My phone prompts if I want to use charging only, or android auto, usb tethering etc... I leave it charge only. But app just keeps rolling with "Connecting" message without going to the next stage. Am I doing something wrong? Or does it only work on iphones?

1. Digital Communication 14.1. Introduction to Digital Communication Digital communication is made from two words - digital and communication. Digital refers to the discrete time-varying signal. Communication refers to the exchange of information between two or more sources. Digital communication as a whole refers to the exchange of digital information between the sender and receiver using different devices and methods. The data transmission using analog methods for long-distance communication suffers from distortion, delays, interferences, and other losses. To overcome these problems, the digitization and sampling of signals using different techniques help in making the transmission process more efficient, clear, and accurate. Digital communication is a popular technology used today in electronics. It allows us to access video conferencing, digital meetings, online education, etc. The data can travel up to long distances within a second with the help of the internet and other modes of digital communication. It not only saves money but also saves time and effort. It has also raised the standard of an individual's social, political, and economic life. 14.2. Networks and Busses The wires between the tank and the monitoring location is called a bus or a network. The distinction between these two terms is more semantic than technical, and the two may be used interchangeably for all practical purposes. The term “bus” is usually used in reference to a set of wires connecting digital components within the enclosure of a computer device, and “network” is for something that is physically more widespread. There are many types of buses and networks. Each one has its own applications, advantages, and disadvantages. 12.2.1. Short-distance busses 12.2.1.1. PC/AT Bus used in early IBM-compatible computers to connect peripheral devices such as disk drive and sound cards to the motherboard of the computer.

12.2.1.2. PCI Another bus used in personal computers, but not limited to IBM-compatibles. Much faster than PC/AT. Typical data transfer rate of 100 Mbytes/second (32 bit) and 200 Mbytes/second (64 bit). 12.2.1.3. PCMCIA A bus designed to connect peripherals to laptop and notebook sized personal computers. Has a very small physical “footprint,” but is considerably slower than other popular PC buses. 12.2.1.4. VME A high-performance bus (co-designed by Motorola, and based on Motorola’s earlier Versa-Bus standard) for constructing versatile industrial and military computers, where multiple memory, peripheral, and even microprocessor cards could be plugged in to a passive “rack” or “card cage” to facilitate custom system designs. Typical data transfer rate of 50 Mbytes/second (64 bits wide). 12.2.1.5. VXI An expansion of the VME bus, VXI (VME eXtension for Instrumentation) includes the standard VME bus along with connectors for analog signals between cards in the rack. 12.2.1.6. S-100 Sometimes called the Altair bus, this bus standard was the product of a conference in 1976, intended to serve as an interface to the Intel 8080 microprocessor chip. Similar in philosophy to the VME, where multiple function cards could be plugged in to a passive “rack,” facilitating the construction of custom systems.
12.2.1.7. MC6800 The Motorola equivalent of the Intel-centric S-100 bus, designed to interface peripheral devices to the popular Motorola 6800 microprocessor chip. 12.2.1.8. STD Stands for Simple-To-Design and is yet another passive “rack” similar to the PC/AT bus, and lends itself well toward designs based on IBM-compatible hardware. Designed by Pro-Log, it is 8 bits wide (parallel), accommodating relatively small (4.5 inch by 6.5 inch) circuit cards. 12.2.1.9. Multibus I and II Another bus intended for the flexible design of custom computer systems, designed by Intel. 16 bits wide (parallel). 12.2.1.10. CompactPCI An industrial adaptation of the personal computer PCI standard, designed as a higher-performance alternative to the older VME bus. At a bus clock speed of 66 MHz, data transfer rates are 200 Mbytes/ second (32 bit) or 400 Mbytes/sec (64 bit). 12.2.1.11. Microchannel Yet another bus, this one designed by IBM for their ill-fated PS/2 series of computers, intended for the interfacing of PC motherboards to peripheral devices. 12.2.1.12. IDE A bus used primarily for connecting personal computer hard disk drives with the appropriate peripheral cards. Widely used in today’s personal computers for hard drive and CD-ROM drive interfacing.
12.2.1.13. SCSI An alternative (technically superior to IDE) bus used for personal computer disk drives. SCSI stands for Small Computer System Interface. Used in some IBM- compatible PC’s, as well as Macintosh (Apple), and many mini and mainframe business computers. Used to interface hard drives, CD-ROM drives, floppy disk drives, printers, scanners, modems, and a host of other peripheral devices. Speeds up to 1.5 Mbytes per second for the original standard. 12.2.1.14. GPIB (IEEE 488) General Purpose Interface Bus, also known as HPIB or IEEE 488, which was intended for the interfacing of electronic test equipment such as oscilloscopes and multimeters to personal computers. 8 bit wide address/data “path” with 8 additional lines for communications control. 12.2.1.15. Centronics parallel Widely used on personal computers for interfacing printer and plotter devices. Sometimes used to interface with other peripheral devices, such as external ZIP (100 Mbyte floppy) disk drives and tape drives. 12.2.1.16. USB Universal Serial Bus, which is intended to interconnect many external peripheral devices (such as keyboards, modems, mice, etc.) to personal computers. Long used on Macintosh PC’s, it is now being installed as new equipment on IBM-compatible machines. 12.2.1.17. FireWire (IEEE 1394) A high-speed serial network capable of operating at 100, 200, or 400 Mbps with versatile features such as “hot swapping” (adding or removing devices with the power on) and flexible topology. Designed for high-performance personal computer interfacing.
12.2.1.18. Bluetooth A radio-based communications network designed for office linking of computer devices. Provisions for data security designed into this network standard. 12.2.2. Extended-distance networks 12.2.2.1. 20 mA current loop Not to be confused with the common instrumentation 4-20 mA analog standard, this is a digital communications network based on interrupting a 20 mA (or sometimes 60 mA) current loop to represent binary data. Although the low impedance gives good noise immunity, it is susceptible to wiring faults (such as breaks) which would fail the entire network. 12.2.2.2. RS-232C The most common serial network used in computer systems, often used to link peripheral devices such as printers and mice to a personal computer. Limited in speed and distance (typically 45 feet and 20 kbps, although higher speeds can be run with shorter distances). I’ve been able to run RS-232 reliably at speeds more than 100 kbps, but this was using a cable only 6 feet long! RS- 232C is often referred to simply as RS-232 (no “C”). 12.2.2.3. RS-422A/RS-485 Two serial networks designed to overcome some of the distance and versatility limitations of RS-232C. Used widely in industry to link serial devices together in electrically “noisy” plant environments. Much greater distance and speed limitations than RS-232C, typically over half a mile and at speeds approaching 10 Mbps. 12.2.2.4. Ethernet (IEEE 802.3) A high-speed network which links computers and some types of peripheral devices together. “Normal” Ethernet runs at a speed of 10 million bits/second, and “Fast” Ethernet runs at 100 million bits/second. The slower (10 Mbps) Ethernet has been implemented in a variety of means on copper
wire (thick coax = “10BASE5”, thin coax = “10BASE2”, twisted-pair = “10BASE- T”), radio, and on optical fiber (“10BASE-F”). The Fast Ethernet has also been implemented on a few different means (twisted-pair, 2 pair = 100BASE-TX; twisted-pair, 4 pair = 100BASE-T4; optical fiber = 100BASE-FX). 12.2.2.5. Token ring Another high-speed network linking computer devices together, using a philosophy of communication that is much different from Ethernet, allowing for more precise response times from individual network devices, and greater immunity to network wiring damage. 12.2.2.6. FDDI A very high-speed network exclusively implemented on fiber-optic cabling. 12.2.2.7. Modbus/Modbus Plus Originally implemented by the Modicon corporation, a large maker of Programmable Logic Controllers (PLCs) for linking remote I/O (Input/Output) racks with a PLC processor. Still quite popular. 12.2.2.8. Profibus Originally implemented by the Siemens corporation, another large maker of PLC equipment. 12.2.2.9. Foundation Fieldbus A high-performance bus expressly designed to allow multiple process instruments (transmitters, controllers, valve positioners) to communicate with host computers and with each other. May ultimately displace the 4-20 mA analog signal as the standard means of interconnecting process control instrumentation in the future.
14.3. Data Flow Buses and networks are designed to allow communication to occur between individual devices that are interconnected. The flow of information, or data, between nodes, can take a variety of forms: With simplex communication, all data flow is unidirectional: from the designated transmitter to the designated receiver. BogusBus is an example of simplex communication, where the transmitter sent information to the remote monitoring location, but no information is ever sent back to the water tank. If all we want to do is send information one-way, then simplex is just fine. Most applications, however, demand more: With duplex communication, the flow of information is bi- directional for each device. Duplex can be further divided into two sub- categories:
The Half-Duplex works like a type of communication, that may be likened to two tin cans on the ends of a single taut string: Either can may be used to transmit or receive, but not at the same time. Full-duplex communication is more like a true telephone, where two people can talk at the same time and hear one another simultaneously, the mouthpiece of one phone transmitting the earpiece of the other, and vice versa. Full-duplex is often facilitated through the use of two separate channels or networks, with an individual set of wires for each direction of communication. It is sometimes accomplished by means of multiple-frequency carrier waves, especially in radio links, where one frequency is reserved for each direction of communication.
14.5. Optical Data Communication A modern alternative to sending (binary) digital information via electric voltage signals is to use optical (light) signals. Electrical signals from digital circuits (high/low voltages) may be converted into discrete optical signals (light or no light) with LEDs or solid-state lasers. Likewise, light signals can be translated back into electrical form by photodiodes or phototransistors for introduction into the inputs of gate circuits. Transmitting digital information in optical form may be done in open air, simply by aiming a laser at a photodetector at a remote distance, but interference with the beam in the form of temperature inversion layers, dust, rain, fog, and other obstructions can present significant engineering problems:
One way to avoid the problems of open-air optical data transmission is to send the light pulses down an ultra-pure glass fibre. Glass fibres will “conduct” a beam of light much as a copper wire will conduct electrons, with the advantage of completely avoiding all the associated problems of inductance, capacitance, and external interference plaguing electrical signals. Optical fibres keep the light beam contained within the fibre core by a phenomenon known as total internal reflectance. An optical fibre is composed of two layers of ultra- pure glass, each layer made of glass with a slightly different refractive index, or capacity to “bend” light. With one type of glass concentrically layered around a central glass core, light introduced into the central core cannot escape outside the fibre, but is confined to travel within the core: Optical fibres exceed the data-handling performance of copper wire in almost every regard. They are totally immune to electromagnetic interference and have very high bandwidths. However, they are not without certain weaknesses.
14.6. Network Topology 14.6.1. Point-to-Point Connecting two digital devices with a network, would have a kind of network known as “point-to-point:” The network wiring is symbolized as a single line between the two devices. It may be a twisted pair of wires, a coaxial cable, an optical fibre, or even a seven-conductor BogusBus. 14.6.2. Bus Topology A type of network which uses a common transmission medium where all nodes of network are connected to it.
14.6.3. Star Topology A type of network that uses a hub, switch, or computer to act as a central network and which all the nodes connect to it. The selected hub, switch or computer acts as a server. 14.6.4. Ring Topology This topology provides the best reliability with the least amount of wiring. Since each node has two connection points to the ring, a single break in any part of the ring doesn’t affect the integrity of the network.
14.7. Network Protocols The standardized method by which nodes are allowed to transmit to the bus or network wiring is called a protocol. There are many different protocols for arbitrating the use of a common network between multiple nodes, and I’ll cover just a few here. However, it is good to be aware of these few, and to understand why some work better for some purposes than others. Usually, a specific protocol is associated with a standardized type of network. This is merely another “layer” to the set of standards which are specified under the titles of various networks. The International Standards Organization (ISO) has specified a general architecture of network specifications in their DIS7498 model (applicable to most any digital network). Consisting of seven “layers,” this outline, named the Open Systems Interconnection Layer (OSI Layer) attempts to categorize all levels of abstraction necessary to communicate digital data. Level 1: Physical Specifies electrical and mechanical details of communication: wire type, connector design, signal types and levels. Level 2: Data link Defines formats of messages, how data is to be addressed, and error detection/correction techniques. Level 3: Network Establishes procedures for encapsulation of data into “packets” for transmission and reception. Level 4: Transport Among other things, the transport layer defines how complete data files are to be handled over a network. Level 5: Session Organizes data transfer in terms of beginning and end of a specific transmission. Analogous to job control on a multitasking computer operating system.
Level 6: Presentation Includes definitions for character sets, terminal control, and graphics commands so that abstract data can be readily encoded and decoded between communicating devices. Level 7: Application The end-user standards for generating and/or interpreting communicated data in its final form. In other words, the actual computer programs using the communicated data. 14.8. Practical considerations - Digital Communication A principal consideration for industrial control networks, where the monitoring and control of real-life processes must often occur quickly and at set times, is the guaranteed maximum communication time from one node to another. The ability for a network to guarantee data “throughput” is called determinism. A deterministic network has a guaranteed maximum time delay for data transfer from node to node, whereas a non-deterministic network does not. The preeminent example of a non-deterministic network is Ethernet, where the nodes rely on random time-delay circuits to reset and re-attempt transmission after a collision.

Filth - Ground Slam + Knuckleblaster
Stray - Whiplash + Shotgun or Ground Slam + Knuckleblaster if I’m at low health.
Schism - Whiplash + Shotgun or Ground Slam + Knuckleblaster if I’m at low health.
Soldier - Whiplash + Shotgun or Ground Slam + Knuckleblaster if I’m at low health.
Drone - I’ll try to whiplash it and punch it with the Knuckleblaster or sometimes the Feedbacker if I can time it right and just punch it into a stray that’s just standing their waiting to die. If there is a bunch of them next to each other I’ll just use the alt piercer.
Street Cleaner - Run backwards and throw coins into air and try to hit them, then I backpedaled off the stage and almost die. If there is is another one that gets knocked into the air from the explosion, I’ll try to shoot it out of the air with the alt piecer.
Swordsmachine - Throw some saws on the ground, shoot some overheated nails, maybe the rail cannon or a rocket, some parrying here and there. If it gets stuck on a jump pad, I just pro boost several times until it’s dead. Usually it’s the last enemy I kill.
Mindflayer - Instakill it with Malicious Rail Cannon or just use every gun I have.
Maurice - Just use Sharpshooter but if that doesn’t work I just shotgun swap. I will also parry its laser whenever I can. Sharpshooter made this game way easier.
Cerberus - Throw down some saws on the ground and wait for Andre to walk into them, then I use over heat nails and after that I switch to Rail Cannon, If there is another one I will not only try to split nails between them but also line up my shot with the Rail Cannon. I will then fire a rocket or two at one of them which will kill it and use a cannonball on the other one.
Hideous Mass - Fuck this guy, all I do is panic and fire nails and rails and drills and alt piercer and prayers into this pile of shit.
Virtue - Just shoot it with the rail cannon but if I don’t have it charged I just use everything else.
Stalker - Ground Slam + Alt Revolver or I just snipe it with Alt Revolver before it does it’s thing.
Insurrectionist - Attractor Saws + Overneat Nailgun + Rail Cannon + really anything that can light it on fire. Use the Cannonball whenever and I don’t mind parrying it’s attacks either.
Sentry - Ground slam it out of the ground and punch it with the Knuckleblaster into the easiest death pit I can punch it into. I the arena doesn’t allow me to do that I use every gun I have on it.
Idol - What do you think?
Ferryman - I haven’t fought this guy that much but whenever he shows up I just use the same strategy as Swordsmachine but with more panic.

Using pro tools 11
I've been using pro tools for about a year and a half, I never watched any tutorials (I don't mean to sound like idiot asshole I just have terrible ADHD n can concentrate for 20 mins + later on I watch them lol) I just dove in head first. It's not that I dont know how to get a good recording I just want to hear first hand from more experienced people.
I use a SM7B microphone with a cloud lifter
I started early on not adjusting anything other than than the volume on the interface (Scarlett i8) I never touched any faders or anything. I honestly got some of my best recording before I knew anything.
The i8 has that lil visual volume/gain display and obviously I tried to get it into the green before recording. (Between -12 n -18 db)
id turn the lil gain nob up directly on the recorded vocal wave and at around +8-+9db.... the mountain shape of the takes were stronger and higher than now. I'd be about the same If turn the gain nob up now +16-+17db. (Not the fader just the actual lil volume control attached to the vocal take)
(3-8 months in)
Fast forward a little, my friend let me use his interface (Scarlett i8) and he needed it back, so I just picked up the Scarlett solo. The solo blinks green when the gain is set at -12 to -18db so I'm aware of that.
I didn't start by creating vocal busses. This might sound stupid but I'm not a big fan of vocal bussing because I like the takes to have individual textures and differences. I'm constantly changing the mix on the vocal going back and forth between amps and a more dry mix.
I just found that bussing the vocals and effects made it much more confusing when I wanted to do specific changes.
I do definitely use a Master fader though.
But what I was doing was adding an output (where S A-E is located in the mixer) - -> (built in output 1-2 stereo) then turning the fader up to around -20 db then re-adjusting the interface to the proper volume before recording. The takes sounded lively n sharp but the actual signal looked lower + was having a lot of issues with plosives and harsh S sounds. (Not touching the recording/volume fader underneath the I/o settings n stuff)
(Now)
Now I dont do that instead I turn the volume down on the recording fader (-1.7) not the output fader I was assigning before.
Then adjusting the interface properly. The actual signal again is much like it was before but a lil more meaty on the low end. The vocal comes in small like very small. But idk if that's normal, all my friend have different daws. When I look at tutorials I'm just staring at the vocal and trying to see how the wave came and recorded but I still have questions.
I record with about 6 plugin (2 eqs (7 band + channel strip) + (2 compressors a basic one, n I use smack just for texture not really as a compressor) + (desser n saturation)
I prefer to record my vocals at a lower volume because they sound better. But I don't think I'm recording them too quiet because when I bounce the mix the vocals still have strength in them.
I'm just in a place where I'm a little confused and I'm not sure what the specific answer is. Assuming the interface is set properly and is recording at -12 to -18 DB do you adjust any vocal volume settings within pro tools?
And I'm using a MacBook Air 2017, 8gb ram. Will the additional plugins due to not busing effect the vocal coming into the laptop (CPU issues).
Also would changing the bit depth from 24 to 32 help anything. I know it's probably circumstantial
I'm sorry for reading this was annoying I tried to be as specific as possible.
If you notice anything really dumb I was doing please tell me.
Thank u for any feedback

About 3 weeks ago I was using my pc (just using photoshop) and then I heard a weird noise. Like crackling. It lasted like 2 or 3 seconds. When I looked down at my pc wondering about the noise, it went out.. and light blue smoke started coming out of it.
Turns out the vrm on my motherboard had burned up. More specifically, thr mosfet. I had been using an asrock 970 pro 3 r2.0. No overclocking.
I did not turn it back on. I immediately brought it to a local repaipart shop and had them diagnose what part was faulty and what I needed to replace. They did a great job a few years ago when my fridge shorted and took my prior motherboard with it.
They determined that nothing was damaged, except the motherboard. Neither the hard drives, the gpu, the psu or the ram sticks. Though they couldnt test the fx 8350 because they did not have the means to test that socket.
I ordered a new motherboard. Asrock extreme 3 r2.0. Only difference really is that this one has a heatsink on the vrm. Transfered the cpu over to the new motherboard (and fixed a slighly bent pin). Transfered all the other parts.. Pulled up the manual etc. to make sure I plugged everything in correctly... Plugged it in - just the power cord.. started the pc...
And it started to smell burned within seconds. Hit the psu switch. Unplugged. Opened it.. couldnt determin where the smell was coming from. No smoke. No visibke damage. At that point the pc had not been used in almost 4 weeks (because I unsuccessfuly tried to replace the broken board with an intel board+ cpu that didnt support my psu and did not fit into my chasis.. and subsequently had to wait a while for the new motherboard to arrive by mail)..parts were laying around disassembled for weeks. Plenty of time to "air out"... so chances for "residue smell" very slim IMO.
I also did not use the same power outlet to turn the pc on. Does anyone have any idea what may be the problem? Where do I go from here? I desperately need this pc to work, because I need it for work.
970 extreme 3 r2.0 (AM3+)
AMD FX 8350
Nvidia 1070 ti
4x Patriot 8GB RAM DDR3
Be quiet pure power 11 500W
1× seagate 500 gb hdd
1x seagate barracuda 1tb hdd
Edit: The only weird thing I did was plug the 4 pin psu fan connector into the 3 pin power fan connector on the motherboard. Googled it beforehand. Apparently thats fine - just means that the fan spins all the time. Thats all I can think of in terms of causes.

Is it just me or is the bass on the enco x2 weak or something? I'm no expert so not sure how it should be.
I'm using joe eq from HeyMelody app. Device is macbook air with AptX on (aac)
My galaxy buds2 pro had better bass but not sure about overall sound

For general offers you can check in with anything, though anything going in my effects section must be stereo. I am good on fuzz, reverb and delay. Thank you for reading.
Furthermore, I am more willing to trade my EAE gear as they've been off my board for a while now. Less feelery than past posts.

Feelers:

EAE Longsword 4.5 Black sparkle EAE Limelight v2 BOSS RC-5 (Plus Saturnworks two button auxiliary switch for BOSS pedals in bare micro enclosure)

Have:

Chase Bliss Audio Preamp MkII Strymon Riverside BOSS RV-500 EQD Plumes Analog.man Prince of Tone JHS AT+ EQD Acapulco Gold Crowther Hot Cake (just in, new in box) DOD Carcosa Spruce Effects The Gale v2 EQD Astral Destiny VOX Copperhead VOX Mystic Edge Behringer SF-300 Behringer TO-800
Non pedals Trutone CS6 with box and cables (some scraping where it was screwed into a pedalboard, just cosmetic) Fender Mustang Micro Nux Mighty Air Marshall DSL1CR (only for pickup in NYC)

Want:

Eventide H90 HX Effects Morningstar MC6 Pro Walrus M1 Strymon Flint v2 Keeley Hydra Plethora X5 Tube Screamer Mini Hudson broadcast (non-AP) 1981 DRV DigiTech FreqOut MXR Phase 95 Tele pickups (these could also be neck humbuckers/single coil sized bridge humbuckers) Fishman fluence tele set Humbucker sets Nintendo Switch Pro Controller Offers!

Global Info Research announces the release of the report “Global Thermal Printing and Labeling Machines Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029” . The report is a detailed and comprehensive analysis presented by region and country, type and application. As the market is constantly changing, the report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided. In addition, the report provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
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According to our (Global Info Research) latest study, the global Thermal Printing and Labeling Machines market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Key Features:
Global Thermal Printing and Labeling Machines market size and forecasts, in consumption value), sales quantity, and average selling prices, 2018-2029
Global Thermal Printing and Labeling Machines market size and forecasts by region and country, in consumption value, sales quantity, and average selling prices, 2018-2029
Global Thermal Printing and Labeling Machines market size and forecasts, by Type and by Application, in consumption value, sales quantity, and average selling prices, 2018-2029
Global Thermal Printing and Labeling Machines market shares of main players, shipments in revenue, sales quantity, and ASP, 2018-2023
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The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thermal Printing and Labeling Machines
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thermal Printing and Labeling Machines market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments.
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Request Free Sample Copy Or buy this report at:
https://www.globalinforesearch.com/reports/1535471/thermal-printing-and-labeling-machines
The Thermal Printing and Labeling Machines market is segmented as below:
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Market segment by Type
Below 50 Packs/min
50-125 Packs/min
Above 125 Packs/min
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Market segment by Application
Food and Beverage
Pharma
Electronics
Others
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Major players covered
Markem-Imaje
Avery Dennison
Videojet
Cotao
Domino
Weber Packaging Solutions
Arca Etichette
Pro Mach
Label Aire
Etipack
Espera-Werke
Guangdong Gosunm
XRH
ALTECH
Quadrel Labeling Systems
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The Main Contents of the Report, includes a total of 15 chapters:
Chapter 1, to describe Thermal Printing and Labeling Machines product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thermal Printing and Labeling Machines, with price, sales, revenue and global market share of Thermal Printing and Labeling Machines from 2018 to 2023.
Chapter 3, the Thermal Printing and Labeling Machines competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thermal Printing and Labeling Machines breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Thermal Printing and Labeling Machines market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thermal Printing and Labeling Machines.
Chapter 14 and 15, to describe Thermal Printing and Labeling Machines sales channel, distributors, customers, research findings and conclusion.
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The analyst presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on the Thermal Printing and Labeling Machines market covers the following areas:
1.Thermal Printing and Labeling Machines market sizing
2.Thermal Printing and Labeling Machines market forecast
3.Thermal Printing and Labeling Machines market industry analysis
4.Analyze the needs of the global Thermal Printing and Labeling Machines business market
5.Answer the market level of global Thermal Printing and Labeling Machines
6.Statistics the annual growth of the global Thermal Printing and Labeling Machines production market
7.The main producers of the global Thermal Printing and Labeling Machines production market
8.Describe the growth factor that promotes market demand
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Global Info Research is a company that digs deep into global industry information to support enterprises with market strategies and in-depth market development analysis reports. We provides market information consulting services in the global region to support enterprise strategic planning and official information reporting, and focuses on customized research, management consulting, IPO consulting, industry chain research, database and top industry services. At the same time, Global Info Research is also a report publisher, a customer and an interest-based suppliers, and is trusted by more than 30,000 companies around the world. We will always carry out all aspects of our business with excellent expertise and experience.
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Contact Us:
Global Info Research
Web: https://www.globalinforesearch.com
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HK: 00852-5819 7708
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Email: [email protected]
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Timestamp: https://imgur.com/a/90jWHCc
Mock12 upper is $750 w/ all accessories Bcg, ch rail panels, buis, and $600 without Bcg and CH it has < 500 rounds and is very precise can do sub moa 10 shot group w/ hornady 60 grain Vmax pic included if 100 yard group. Parts list as follows with price it would cost to build it new. BCM m4 upper -129 FN chf chrome 18” spr midlen-349 Microbest Phosphate C158 bcg-129 Ops in muzzle brake and long collar-170 Badger Ordnance MK12 gas block-80 Bcm gas tube -20 MIdwest ind 14” combat quad - 220 Strike industries black aluminum dc-30 PRI M84 ambi FDE - 93 Kac Taupe rail panels-80 P&S broom handle-20 Utg pro buis -50 Total to build is over 1300 and I want $750 w everything and $600 stripped, upper has very light salt was previously rattle canned but fully stripped. Bore is bright and shiny
Larue RISR low sodium-$40 Sold
Holosun Aems green reticle opmod FDE- new with box mounted and removed zero salt- $350 sold
https://i.imgur.com/iZSfZ3k.jpg
Arisaka picatinny scout mount low sodium never ran- $40
Surefire Z68 Clicky - $20
AT3 FDE pack of 3 rail covers-$10
Aero stainless rifle gas tube new in box - $12 sold
Solgw Bcg new with box no rounds outside of factory proofing $120sold
Radian Talon Ch some salt $50 Sold
Dead Air keymo 3 prong with accu washer set 1/2-28 new never ran $80sold
Strike industries FDE alluminum dust cover some salt- $15
18650 2600 mah protected rechargeable battery new- $12
If upper is sold stripped then $75 for ambi m84 FDE Ch and microbest phosphate carrier $80
Black Dillo $10 Sold

I would like to use a physical keyboard with my Note Air 2 plus. But when I connect a physical keyboard like My Logitech K380 to my Boox tablet, the Boox automatically uses 'keyboard shortcuts', which I do not find handy. For example, Shift and Ctrl switches between input methods. But I like to select multiple words and copy and paste them. Now every time I select words using these keys, I'm simultaneously switching the input method between 1) ONYX Keyboard and 2) Android Keyboard (AOSP). Is there a way to disable the standard keyboard short cuts of my Boox? I tried installing the app 'External Keyboard Helper Pro', to see Iif I could remap the standard keys, but that doesn't seem to work (or I don't know how to set it up properly).
Thanks.

Hi everyone,
I'm looking for recommendations on a camera or camera setup, along with a smaller and more affordable laser scanner, for capturing 360 videos and generating a point cloud. I'm particularly interested in understanding the difficulty involved in exporting the point cloud, as I need something that will create the point cloud with not too much additional post processing as we are limited in staff.
Here's what I need: I require a camera that can be accessed remotely for file naming and survey initiation. It should also allow for easy creation of a point cloud with an accuracy of up to 3cm. The camera will primarily be used for inspecting manholes and silo, reaching depths of up to 12 meters. It's essential that we conduct regular inspections and name the videos according to the corresponding manhole IDs.
I'm aware that models like the GoPro Max, Insta 360, and DJI Osmo are capable of capturing high-resolution 360 videos. However, I'm uncertain whether it's possible to connect to these cameras and manually assign names to the videos before starting the survey. Additionally, I'm unsure about the process of constructing a point cloud using these video recordings.
I would greatly appreciate any ideas or suggestions you may have regarding suitable camera setups or alternative solutions for achieving my requirements.
Thank you in advance!